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1

Properties of high reinforcement-content aluminum matrix composite for electronic packages

Gaohui Wu, Qiang Zhang, Guoqin Chen, Longtao Jiang, Ziyang Xiu

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2003

Мова:

english

Файл:

PDF, 613 KB

english, 2003

2

[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Performance and application of SiCp/Al composites for electronic packaging

Qiang Zhang,, Liu, Dan, Guoqin Chen,, Ziyang Xiu,, Gaohui Wu,

Рік:

2009

Мова:

english

Файл:

PDF, 1.48 MB

english, 2009

3

Sn–3.0Ag–0.5Cu nanocomposite solders reinforced by graphene nanosheets

Huang, Yilong, Xiu, Ziyang, Wu, Gaohui, Tian, Yanhong, He, Peng

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2016

Мова:

english

Файл:

PDF, 2.27 MB

english, 2016

4

Microstructure Evolution of Ti-Al-C System Composite

Liu Yanmei, Xiu Ziyang, Wu Gaohui, Jiang Longtao, Gou Huasong, Jiang Guoqing

Журнал:

Rare Metal Materials and Engineering

Рік:

2010

Мова:

english

Файл:

PDF, 765 KB

english, 2010

5

Microstructural characteristics of Ce conversion coatings on Cf/Al composite or NiP plated Cf/Al composite

Chunyu Wang, Ziyang Xiu, Qiang Zhang, Gaohui Wu

Журнал:

Surface and Interface Analysis

Рік:

2008

Мова:

english

Файл:

PDF, 455 KB

english, 2008

6

Reaction procedure of a graphite fiber reinforced Ti-Al composite produced by squeeze casting-in situreaction

Gaohui Wu, Yanmei Liu, Ziyang Xiu, Longtao Jiang, Wenshu Yang

Журнал:

Рік:

2010

Мова:

english

Файл:

PDF, 770 KB

english, 2010

7

Microstructure and tensile properties of Si3N4p/2024Al composite fabricated by pressure infiltration method

Ziyang Xiu, Wenshu Yang, Guoqing Chen, Longtao Jiang, Kang Ma, Gaohui Wu

Журнал:

Materials & Design

Рік:

2012

Мова:

english

Файл:

PDF, 1.24 MB

english, 2012

8

Property characteristics of a AlNp/Al composite fabricated by squeeze casting technology

Qiang Zhang, Guoqin Chen, Gaohui Wu, Ziyang Xiu, Bofeng Luan

Журнал:

Materials Letters

Рік:

2003

Мова:

english

Файл:

PDF, 340 KB

english, 2003

9

Mechanical Properties of Cf/Mg Composites Fabricated by Pressure Infiltration Method

Meihui Song, Gaohui Wu, Wenshu Yang, Wei Jia, Ziyang Xiu, Guoqin Chen

Журнал:

Journal of Materials Science & Technology

Рік:

2010

Мова:

english

Файл:

PDF, 611 KB

english, 2010

10

Effect of Iron Particle Size and Volume Fraction on the Magnetic Properties of Fe/Silicate Glass Soft Magnetic Composites

Wei Ding, Rui Wu, Ziyang Xiu, Guoqin Chen…

Журнал:

Journal of Superconductivity and Novel Magnetism

Рік:

2014

Мова:

english

Файл:

PDF, 1.09 MB

english, 2014

11

Microstructure and properties of Sip/Al–20

Liu, Jun, Xiu, Ziyang, Liang, Xue, Li, Qiang, Hussain, Murid, Qiao, Jing, Jiang, Longtao

Журнал:

Journal of Materials Science

Рік:

2014

Мова:

english

Файл:

PDF, 708 KB

english, 2014

12

Effect of thermal cycling on the mechanical properties of Cf/Al composites

Daguang, Li, Guoqin, Chen, Longtao, Jiang, Ziyang, Xiu, Yunhe, Zhang, Gaohui, Wu

Журнал:

Materials Science and Engineering: A

Рік:

2013

Мова:

english

Файл:

PDF, 3.26 MB

english, 2013

13

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - The thermal and electric conduction properties of high dense TiB2P/Cu composites fabricated by squeeze casting technology

Guoqin Chen,, Ziyang Xiu,, Songhe Meng,, Gaohui Wu,, Su Chen,

Рік:

2008

Мова:

english

Файл:

PDF, 657 KB

english, 2008

14

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - Study on properties of high reinforcement-content aluminum matrix composite for electronic packages

Ziyang Xiu,, Dezhi Zhu,, Qiang Zhang,, Gaohui Wu,

Рік:

2005

Мова:

english

Файл:

PDF, 685 KB

english, 2005

15

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Microstructure and properties of environmental-friendly Sip/1199Al composites used for electronic packaging

Ziyang Xiu,, Guoqin Chen,, Zongquan Deng,, Gaohui Wu,

Рік:

2008

Мова:

english

Файл:

PDF, 425 KB

english, 2008

16

MECHANISM AND MICROSTRUCTURE TRANSFORMATION OF 3D-Si/LG5 COMPOSITES BY HIGH TEMPERATURE DIFFUSION TREATMENT

XIU, ZIYANG, DENG, ZONGQUAN, WANG, XIAOFENG, WU, GAOHUI

Журнал:

International Journal of Modern Physics B

Рік:

2009

Мова:

english

Файл:

PDF, 161 KB

english, 2009

17

Microstructure characterization of SiC nanowires as reinforcements in composites

Dong, Ronghua, Yang, Wenshu, Wu, Ping, Hussain, Murid, Xiu, Ziyang, Wu, Gaohui, Wang, Pingping

Журнал:

Materials Characterization

Рік:

2015

Мова:

english

Файл:

PDF, 1.96 MB

english, 2015

18

Microstructure and Mechanical Properties of 45 vol.% SiCp/7075Al Composite

Xiu, Ziyang, Yang, Wenshu, Dong, Ronghua, Hussain, Murid, Jiang, Longtao, Liu, YongXing, Wu, Gaohui

Журнал:

Journal of Materials Science & Technology

Рік:

2015

Мова:

english

Файл:

PDF, 1.70 MB

english, 2015

19

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

Jiang, Longtao, Wang, Pingping, Xiu, Ziyang, Chen, Guoqin, Lin, Xiu, Dai, Chen, Wu, Gaohui

Журнал:

Materials Characterization

Рік:

2015

Мова:

english

Файл:

PDF, 2.87 MB

english, 2015

20

Enhanced thermal conductivity and flexural properties in squeeze casted diamond/aluminum composites by processing control

Wang, Pingping, Xiu, Ziyang, Jiang, Longtao, Chen, Guoqin, Lin, Xiu, Wu, Gaohui

Журнал:

Materials & Design

Рік:

2015

Мова:

english

Файл:

PDF, 1.38 MB

english, 2015

21

Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets

Huang, Yilong, Xiu, Ziyang, Wu, Gaohui, Tian, Yanhong, He, Peng, Gu, Xiaolong, Long, Weimin

Журнал:

Materials Letters

Рік:

2016

Мова:

english

Файл:

PDF, 1.62 MB

english, 2016

22

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

Huang, Yilong, Xiu, Ziyang, Tian, Yanhong

Рік:

2016

Мова:

english

Файл:

PDF, 396 KB

english, 2016

23

Microstructural evolution of Li-Ti ferrite/composite braze/Li-Ti ferrite joints reinforced by Bi5(Ti3Fe)O15 whiskers

Lin, Panpan, Lin, Tiesong, He, Peng, Sekulic, Dusan P., Xiu, Ziyang, Wang, Jiandong

Журнал:

Journal of the European Ceramic Society

Рік:

2016

Мова:

english

Файл:

PDF, 1.16 MB

english, 2016

24

Effect of extrusion treatment on the microstructure and mechanical behavior of SiC nanowires reinforced Al matrix composites

Xin, Ling, Yang, Wenshu, Zhao, Qiqi, Dong, Ronghua, Liang, Xue, Xiu, Ziyang, Hussain, Murid, Wu, Gaohui

Журнал:

Materials Science and Engineering: A

Рік:

2016

Мова:

english

Файл:

PDF, 1.56 MB

english, 2016

25

Strengthening behavior in SiC nanowires reinforced pure Al composite

Xin, Ling, Yang, Wenshu, Zhao, Qiqi, Dong, Ronghua, Wu, Ping, Xiu, Ziyang, Hussain, Murid, Wu, Gaohui

Журнал:

Journal of Alloys and Compounds

Рік:

2016

Мова:

english

Файл:

PDF, 10.07 MB

english, 2016

26

Microstructure evolution of SiC/SiC joints during ultrasonic-assisted air bonding using a Sn–Zn–Al alloy

Wu, Bingzhi, Guo, Weibing, He, Jingshan, Xiu, Ziyang, Yan, Jiuchun

Журнал:

Ceramics International

Рік:

2017

Мова:

english

Файл:

PDF, 1.17 MB

english, 2017

27

Induction of anti-agrin antibodies causes myasthenia gravis in mice

Yan, Min, Liu, Ziyang, Fei, Erkang, Chen, Wenbing, Lai, Xinsheng, Luo, Bin, Chen, Peng, Jing, Hongyang, Pan, Jin-xiu, H.Rivner, Michael, Xiong, Wen-Cheng, Mei, Lin

Журнал:

Рік:

2018

Мова:

english

Файл:

PDF, 738 KB

english, 2018

28

Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound

Wu, Bingzhi, Leng, Xuesong, Xiu, Ziyang, Yan, Jiuchun

Журнал:

Ultrasonics Sonochemistry

Рік:

2018

Мова:

english

Файл:

PDF, 1.75 MB

english, 2018

29

Microstructure and tensile properties of 5083 Al matrix composites reinforced with graphene oxide and graphene nanoplates prepared by pressure infiltration method

Shao, Puzhen, Yang, Wenshu, Zhang, Qiang, Meng, Qingyu, Tan, Xin, Xiu, Ziyang, Qiao, Jing, Yu, Zhenhe, Wu, Gaohui

Журнал:

Composites Part A: Applied Science and Manufacturing

Рік:

2018

Мова:

english

Файл:

PDF, 3.60 MB

english, 2018

30

Effects of pulse conditions on microstructure and mechanical properties of Si 3 N 4 /6061Al composites prepared by spark plasma sintering (SPS)

Jiang, Han, Xu, Zhongguo, Xiu, Ziyang, Jiang, Longtao, Gou, Huasong, Zhou, Chang, Wu, Gaohui

Журнал:

Journal of Alloys and Compounds

Рік:

2018

Мова:

english

Файл:

PDF, 5.45 MB

english, 2018

31

Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds

Wu, Bingzhi, Leng, Xuesong, Xiu, Ziyang, Yan, Jiuchun

Журнал:

Scientific Reports

Рік:

2018

Мова:

english

Файл:

PDF, 3.71 MB

english, 2018

32

Effect of Interfacial Microstructure on the Mechanical Properties of GNPs/Al Composites

Ju, Boyu, Yang, Wenshu, Shao, Puzhen, Hussain, Murid, Zhang, Qiang, Xiu, Ziyang, Hou, Xuwei, Qiao, Jing, Wu, Gaohui

Журнал:

Рік:

2020

Файл:

PDF, 10.54 MB

2020

33

Microstructure and strength of ultrasonic-assisted brazed joints of Si3N4/6061Al composites

Xu, Guojing, Leng, Xuesong, Jiang, Han, Xiu, Ziyang, Yan, Jiuchun

Журнал:

Journal of Manufacturing Processes

Рік:

2020

Файл:

PDF, 5.94 MB

2020

34

In-situ synthesis of Al3BC/Al composites from amorphous boron and graphene nanoplates by solid reaction

Mei, Yong, Li, Hui, Yang, Wenshu, Wu, Jianfu, Li, Xiao, Xiu, Ziyang, Fu, Jierui, Hussain, Murid, Chen, Guoqin, Wu, Gaohui

Журнал:

Journal of Alloys and Compounds

Рік:

2020

Файл:

PDF, 4.04 MB

2020

35

Quantitative analysis of the effects of particle content and aging temperature on aging behavior in B4C/6061Al composites

Xue, Wei, Jiang, Longtao, Zhang, Bin, Jing, Dan, He, Ting, Chen, Guoqin, Xiu, Ziyang, Wu, Gaohui

Журнал:

Materials Characterization

Рік:

2020

Файл:

PDF, 2.35 MB

2020

36

Bonding and strengthening mechanism on ultrasonic-assisted soldering of sapphire using Sn-3.5Ag-4Al solder

Xu, Yan, Ma, Xinran, Xiu, Ziyang, Yan, Jiuchun

Журнал:

Journal of Materials Processing Technology

Рік:

2021

Файл:

PDF, 11.36 MB

2021